POSSIBILITIES OF USING MIND MAP FOR INTEGRATION OF KNOWLEDGE OF STUDENTS OF HIGHER TECHNICAL SCHOOL

Authors

  • Y. Kozlovskyі
  • I. Kozlovska

Keywords:

integration, mental maps, pedagogical competence, engineering specialties, integral mental 3D map

Abstract

The article presents the research results based on the hypothesis that the application of mental
maps to knowledge integration (integrated volumetric Mind map - IMM-3D) can improve the quality of higher
technical education institutions students’ ability to learn pedagogical disciplines. The atudy aims at representing,
either in theory and on concrete examples, the way integral mental maps organically assimilate into the system of
professional training of future engineers, engineering teachers in particular.
The methodology and the expediency of using the three-dimensional Mind map (IMM-3D) with refinement of
their advantages are explained and justified. Methodology concerning their role and fuctions in engineer for
pedagogical activities training as well as work with production teams is defined. The author's approach to constructing
IMM-3D is described and concrete examples are highlighted. It is concluded that the application of IMM-3D l increases both the level of mastering of knowledge and the
creative level of students while performing tasks. At the same time, the intensive use of the integrative approach to
IMM-3D and the visual use of three-dimensional space while constructing them helps improve students’ problem
solving skills. Consequently, the level of higher technical school students’ pedagogical competence improves
significantly.

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Author Biographies

  • Y. Kozlovskyі

    Lviv, Ukraine

  • I. Kozlovska

    Lviv, Ukraine

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Published

2022-11-23

Issue

Section

PART 5

How to Cite

POSSIBILITIES OF USING MIND MAP FOR INTEGRATION OF KNOWLEDGE OF STUDENTS OF HIGHER TECHNICAL SCHOOL. (2022). Modern Information Technologies and Innovation Methodologies of Education in Professional Training Methodology Theory Experience Problems, 51, 246-250. https://vspu.net/sit/index.php/sit/article/view/5418